ThermalSure^® TEPT X1

ACS Material LLC is excited to bring to market a novel thermal property testing device, ThermalSure^®, which will change the way you measure thermal diffusivity and conductivity on the micro- and nano-scale. Most techniques use a method that inject energy into the sample and then measure the out-of-band radiation along the length of the sample with sensors. ThermalSure^® does it differently. Our method is entirely in-band, which means the sample is the sensor and the result is truer.

ThermalSure^® builds solutions with well researched technology under the leadership and invention of thermodynamics scientists from ACS Material. It is a fast, simple test device that is automated, yet flexible; has a simple tablet interface; and has capabilities that can be extended with additional hardware and software modules.

(Patent Pending)

Photos of ThermalSure^® TEPT X1

Thermal properties can be tested at an accuracry > 95% for:

Schematic illustration of in-plane direction of films

Schematic illustration of in-plane direction of wires

Sample Requirements:

Wires/Films

Samples: Conductive/Non-conductive

Sample Length: a few millimeters

Thermal Diffusivity Testing Range: 0.5x10^-7 ~ 2.0x10^-3 m²s^-1

For Wires:

Diameter: 0.2 um ~ 300 um

For Films:

Thickness: 0.5 um ~ 300 um

Pre-order now and contact us for a quote today!

Disclaimer: ACS Material LLC believes that the information on our website is accurate and represents the best and most current information available to us. ACS Material makes no representations or warranties either express or implied, regarding the suitability of the material for any purpose or the accuracy of the information listed here. Accordingly, ACS Material will not be responsible for damages resulting from use of or reliance upon this information.