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Thermal Conductive Potting Gel

As low as $145.00 $0.00
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SKU# BATPG

Thermal Conductive Potting Gel

Product Detail

The dual-component thermal conductive gel filling material with a thermal conductivity ranging from 0.4 to 4W/m*K is suitable for filling, insulation, and potting. The material requires manual mixing of components A and B, which can cure at room temperature or high temperature. After curing, it exhibits good thermal conductivity, insulation, and shock absorption. Additionally, the thermally conductive potting adhesive adopts an organic silicon formulation system, which is non-toxic, odorless, non-corrosive, and complies with RoHS directives and relevant environmental protection requirements.

1. Features

  • Good insulation and high/low temperature resistance.
  • Flame retardant rating of UL94 V0
  • Good maneuverability and flexibility

2. Characterizations

Before Curing

Tube 1

Tube 2

Testing Standard

Color

Blue/Optional

White

Visual inspection

Viscosity @ 25℃ Rotor

2.5*103 cps

2.0*103 cps

ASTM D445

Density

1.7 g/cc

ASTM D792

After Curing

Thermal Conductive

0.8 W/m*K

ISO22007-2

Size

600ml

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Hardness

50 ShoreA

ASTM D792

Flame Retardant Rating

V0

ASTM D2240

Surface Dry Time @ 25℃

90min

UL94

Curing Time @ 25℃

24 h

Manual Tester

Tensile Strength

0.3 MPa

Hardness Tester

Elongation at Time

30%

ASTM D412

Breakdown Voltage

10 kV/mm

ASTM D412

Volume Resistivity

>1012 Ohm*cm

ASTM D257

D4~D10 content

<100 ppm

GC

Recommend Operating Temperature Range

-40 ~ +150 ℃

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Disclaimer: ACS Material, LLC believes that the information in this Technical Data Sheet is accurate and represents the best and most current information available to us. ACS Material makes no representations or warranties either express or implied, regarding the suitability of the material for any purpose or the accuracy of the information contained within this document. Accordingly, ACS Material will not be responsible for damages resulting from use of or reliance upon this information.